Dynamic peak power management for multi-die operations

ABSTRACT

A method of peak power management (PPM) for a memory chip with multiple memory dies is provided, where each of the multiple memory dies includes a PPM circuit having a PPM contact pad and PPM contact pads of the multiple memory dies are electrically connected. The PPM method includes the following steps: switching on a pull-down driver of the PPM circuit on a selected memory die of the memory chip; verifying a PPM enablement signal regulated by a pull-down current flowing through the pull-down driver; and performing a peak power operation on the selected memory die when the PPM enablement signal indicates that a total current of the memory chip is less than a maximum total current allowed for the memory chip.

CROSS-REFERENCE TO RELATED APPLICATIONS AND INCORPORATION BY REFERENCE

This application claims priority to PCT/CN2020/131692 filed on Nov. 26, 2020, which is incorporated herein by reference in its entirety.

TECHNICAL FIELD

The present disclosure generally relates to the field of semiconductor technology, and more particularly, to circuit designs and methods for peak power management in a storage system.

BACKGROUND

In many servers and mobile devices, a NAND storage system is widely used as the primary non-volatile storage device due to its high storage density and relatively low access latency. However, performance of a high density storage system, for example, a three-dimensional (3D) NAND storage system, is often restricted by the maximum amount of power (or peak current) that it can use. Currently, operations consuming high power (i.e., peak power operations) that are carried out by various memory dies of the NAND storage system can be staggered by a system controller. Only a limited number of peak power operations can be performed simultaneously. This approach can also result in increased system loading with unnecessary over-management. Communications between different memory dies can be established to coordinate the peak power operations. Currently, coordination between two memory dies can be arranged and peak power operations can be staggered between these two memory dies. However, only one peak power operation can be performed at one time. In addition, two or more contact pads are used on each memory die for communications between different memory dies on the same memory chip. Therefore, it is necessary to optimize the peak power management circuits and scheme to coordinate between multiple memory dies such that multiple peak power operations can be performed on a memory chip simultaneously. As such, the storage system's power or current budget can be fully utilized.

BRIEF SUMMARY

An aspect of the present disclosure is to provide effective peak power management for a memory storage system.

One aspect of the present disclosure provides a peak power management (PPM) system for a memory chip with multiple memory dies. The PPM system includes a PPM circuit on each of the multiple memory dies. Each PPM circuit includes a pull-up driver electrically connected to a power source and a PPM resistor; a pull-down driver electrically connected to the PPM resistor; and a PPM contact pad connected to the PPM resistor. PPM contact pads of the multiple memory dies are electrically connected with each other. And the PPM system is configured to manage a peak power operation based on an electric potential of the PPM contact pads.

In some embodiments, the PPM system further includes a comparator with a first input terminal electrically connected to the PPM contact pads of the multiple memory dies and a second input terminal electrically connected to a reference voltage. In some embodiments, an output terminal of the comparator is connected to an inverter. In some embodiments, an RC filter is electrically connected to the PPM contact pads of the multiple memory dies and the first input terminal of the comparator. In some embodiments, the reference voltage is based on a maximum total current allowed on the memory chip.

In some embodiments, the electric potential of the PPM contact pads is adjusted by a pull-down current flowing through the pull-down driver in the PPM circuit. In some embodiments, the pull-down current includes a high current level, the high current level corresponding to a peak current of the peak power operation.

In some embodiments, the pull-up driver includes a p-channel metal oxide semiconductor field effect transistor (MOSFET).

In some embodiments, the pull-down driver includes an n-channel metal oxide semiconductor field effect transistor (MOSFET).

In some embodiments, the PPM contact pad, the PPM resistor and the pull-down driver are electrically connected.

In some embodiments, the PPM contact pad, the PPM resistor and the pull-up driver are electrically connected.

In some embodiments, the PPM contact pads are electrically connected through die-to-die connections, each die-to-die connection including a metal interconnect.

In some embodiments, the PPM contact pads are electrically connected through flip-chip bonding, die-to-die bonding, or wire-bonding.

Another aspect of the present disclosure provides a method of peak power management (PPM) for a memory chip with multiple memory dies, wherein each of the multiple memory dies includes a PPM circuit having a PPM contact pad. PPM contact pads of the multiple memory dies are electrically connected. The PPM method includes the following steps: switching on a pull-down driver of the PPM circuit on a selected memory die of the memory chip; verifying a PPM enablement signal regulated by a pull-down current flowing through the pull-down driver; and performing a peak power operation on the selected memory die when the PPM enablement signal indicates that a total current of the memory chip is less than a maximum total current allowed for the memory chip.

In some embodiments, the method also includes, after switching on the pull-down driver, setting the pull-down current flowing through the pull-down driver on the selected memory die at a high current level, wherein the high current level correspond to a peak current of the peak power operation on the selected memory die.

In some embodiments, the method further includes, after performing the peak power operation, setting the pull-down current flowing through the pull-down driver on the selected memory die to a low current level, wherein the low current level correspond to a base current on the selected memory die.

In some embodiments, the method further includes switching off the pull-down driver on the selected memory die if the PPM enablement signal indicates that the total current of the memory chip is more than the maximum total current allowed for the memory chip.

In some embodiments, the method also includes, after switching off the pull-down driver, waiting for a delay time period.

In some embodiments, the method further includes, prior to verifying the PPM enablement signal, generating the PPM enablement signal by comparing a reference voltage with an electric potential of the PPM contact pads. The reference voltage is selected according to the maximum total current allowed for the memory chip.

In some embodiments, the method also includes regulating the electric potential of the PPM contact pads through the pull-down current of the pull-down driver, wherein the total current of the memory chip corresponds to a sum of the pull-down current flowing through each pull-down driver on the memory chip.

In some embodiments, the PPM enablement signal is set to 0 if the electric potential of the PPM contact pads is higher than the reference voltage; and the PPM enablement signal is set to 1 if the electric potential of the PPM contact pads is lower than the reference voltage.

Other aspects of the present disclosure can be understood by those skilled in the art in light of the description, the claims, and the drawings of the present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated herein and form a part of the specification, illustrate embodiments of the present disclosure and, together with the description, further serve to explain the principles of the present disclosure and to enable a person skilled in the pertinent art to make and use the present disclosure.

FIG. 1A illustrates a storage system with one or more memory chips, according to some embodiments of the present disclosure.

FIG. 1B illustrates a top-down view of a memory die, according to some embodiments of the present disclosure.

FIG. 2 illustrates a peak power management system in a memory chip, according to some embodiments of the present disclosure.

FIG. 3 illustrates a peak power management circuit, according to some embodiments of the present disclosure.

FIG. 4 illustrates a current profile of a memory die, according to some embodiments of the present disclosure.

FIG. 5 illustrates a circuit of a peak power management group, according to some embodiments of the present disclosure.

FIG. 6 illustrates a peak power management scheme, according to some embodiments of the present disclosure.

FIG. 7 illustrates another peak power management circuit, according to some embodiments of the present disclosure.

FIG. 8 illustrates a current profile of a memory die, according to some embodiments of the present disclosure.

The features and advantages of the present invention will become more apparent from the detailed description set forth below when taken in conjunction with the drawings, in which like reference characters identify corresponding elements throughout. In the drawings, like reference numbers generally indicate identical, functionally similar, and/or structurally similar elements.

Embodiments of the present disclosure will be described with reference to the accompanying drawings.

DETAILED DESCRIPTION

Although specific configurations and arrangements are discussed, it should be understood that this is done for illustrative purposes only. A person skilled in the pertinent art will recognize that other configurations and arrangements can be used without departing from the spirit and scope of the present disclosure. It will be apparent to a person skilled in the pertinent art that the present disclosure can also be employed in a variety of other applications.

It is noted that references in the specification to “one embodiment,” “an embodiment,” “an example embodiment,” “some embodiments,” etc., indicate that the embodiment described can include a particular feature, structure, or characteristic, but every embodiment can not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases do not necessarily refer to the same embodiment. Further, when a particular feature, structure or characteristic is described in connection with an embodiment, it would be within the knowledge of a person skilled in the pertinent art to affect such feature, structure or characteristic in connection with other embodiments whether or not explicitly described.

In general, terminology can be understood at least in part from usage in context. For example, the term “one or more” as used herein, depending at least in part upon context, can be used to describe any feature, structure, or characteristic in a singular sense or can be used to describe combinations of features, structures or characteristics in a plural sense. Similarly, terms, such as “a,” “an,” or “the,” again, can be understood to convey a singular usage or to convey a plural usage, depending at least in part upon context. In addition, the term “based on” can be understood as not necessarily intended to convey an exclusive set of factors and may, instead, allow for existence of additional factors not necessarily expressly described, again, depending at least in part on context.

As used herein, the term “nominal/nominally” refers to a desired, or target, value of a characteristic or parameter for a component or a process step, set during the design phase of a product or a process, together with a range of values above and/or below the desired value. The range of values can be due to slight variations in manufacturing processes or tolerances. As used herein, the term “about” indicates the value of a given quantity that can vary based on a particular technology node associated with the subject semiconductor device. Based on the particular technology node, the term “about” can indicate a value of a given quantity that varies within, for example, 10-30% of the value (e.g., ±10%, ±20%, or ±30% of the value).

FIG. 1A illustrates a storage system 10, according to some embodiments of the present disclosure. The storage system 10 (also referred to as a NAND storage system or a solid state drive) can include a host controller 20 and one or more memory chips 25-1, 25-2, 25-3, . . . , 25-n. Each semiconductor memory chip 25 (hereafter just “memory chip”) can be a NAND chip (i.e., “flash,” “NAND flash” or “NAND”). The solid state drive (SSD) 10 can communicate with a host computer 15 through the host controller 20, where the host controller 20 can be connected to the one or more memory chips 25-1, 25-2, 25-3, . . . , 25-n, via one or more memory channels 30-1, 30-2, 30-3, . . . , 30-n. In some embodiments, each memory chip 25 can be managed by the host controller 20 via a memory channel 30.

The host computer 15 sends data to be stored at the NAND storage system or SSD 10 or retrieves data by reading the SSD 10. The host controller 20 can handle I/O requests received from the host computer 15, ensure data integrity and efficient storage, and manage the memory chip 25. The memory channels 30 can provide data and control communication between the host controller 20 and each memory chip 25 via a data bus. The host controller 20 can select one of the memory chip 25 according to a chip enable signal.

FIG. 1B illustrates a top-down view of a NAND flash memory 100, according to some embodiments of the present disclosure. The NAND flash memory 100 can be a memory die (or a die) or any portion of a memory die. In some embodiments, each memory chip 25 in FIG. 1A can include one or more memory dies, e.g., one or more NAND flash memories 100. In some embodiments, each NAND flash memory 100 can include one or more memory planes 101, each of which can include a plurality of memory blocks 103. Identical and concurrent operations can take place at each memory plane 101. The memory block 103, which can be megabytes (MB) in size, is the smallest size to carry out erase operations. Shown in FIG. 1B, the exemplary NAND flash memory 100 includes four memory planes 101 and each memory plane 101 includes six memory blocks 103. Each memory block 103 can include a plurality of memory cells, where each memory cell can be addressed through interconnections such as bit lines and word lines. The bit lines and word lines can be laid out perpendicularly (e.g., in rows and columns, respectively), forming an array of metal lines. The direction of bit lines and word lines are labeled as “BL” and “WL” in FIG. 1B. In this disclosure, the memory block 103 is also referred to as the “memory array” or “array.” The memory array is the core area on a memory die, performing storage functions.

The NAND flash memory 100 also includes a periphery region 105, an area surrounding memory planes 101. The periphery region 105 contains many digital, analog, and/or mixed-signal circuits to support functions of the memory array, for example, page buffers 50, row decoders 40, column decoders 60, peripheral circuits 70 and sense amplifiers 80. Peripheral circuits 70 include active and/or passive semiconductor devices, such as transistors, diodes, capacitors, resistors, etc., as would be apparent to a person of ordinary skill in the art.

It is noted that the layout of the electronic components in the SSD 10 and the NAND flash memory 100 in FIGS. 1A and 1B are shown as examples. The SSD 10 and the NAND flash memory 100 can have other layout and can include additional components. For example, the NAND flash memory 100 can also have high-voltage charge pumps, I/O circuits, etc. The SSD 10 can also include firmware, data scrambler, etc.

FIG. 2 illustrates a peak power management system 200 of the memory chip 25, according to some embodiments of the present disclosure. The peak power management (PPM) system 200 can be implemented in each memory chip 25 of the NAND storage system 10 in FIG. 1A, where each memory chip 25 can include a plurality of memory dies 100-1, 100-2, 100-3, . . . , 100-n, and each memory die can be similar to the NAND flash memory 100 discussed previously in reference with FIG. 1B. In some embodiments, each NAND flash memory 100 can include a peak power management (PPM) circuit 202 where each PPM circuit 202 can include a PPM contact pad 204 (also referred to as PPM pin). The PPM circuits 202-1, 202-2, 202-3, . . . , 202-n on different NAND flash memories 100-1, 100-2, 100-3, . . . , 100-n of the memory chip 25 can communicate with each other through the PPM pins 204-1, 204-2, 204-3, . . . , 204-n. In some embodiments, the PPM pins between different NAND flash memories 100 can be electrically connected with each other through a plurality of die-to-die connections 205. For example, the PPM pin 204-2 on the NAND flash memory 100-2 can be electrically connected with the PPM pin 204-1 on the NAND flash memory 100-1 through the die-to-die connection 205-1 and can be electrically connected with the PPM pin 204-3 on the NAND flash memory 100-3 through the die-to-die connection 205-2. In some embodiments, the die-to-die connections 205 can be a metal wire formed through wire-bonding. In some embodiments, the die-to-die connections 205 can be metal wires or any suitable metal or conductive material formed through flip-chip bonding or any suitable die-to-die bonding. In some embodiments, the die-to-die connections 205 can be formed by through-silicon VIAs (e.g, through-array structures).

By using the die-to-die connections described above, communications between different memory dies (i.e., NAND flash memories 100-1, 100-2, 100-3, . . . , 100-n) can be established in the memory chip 25. As such, the NAND storage system 10 can send operation commands to any number of memory dies at any time while the PPM circuits 202 can control the system's power consumption by selecting one or more memory dies.

FIG. 3 illustrates an exemplary PPM circuit 202 on the NAND flash memory 100, according to some embodiments of the present disclosure. The PPM circuit 202 can include a pull-up driver 314, where one terminal of the pull-up driver 314 is connected to a power source 312 with a voltage V_(dd). In some embodiments, the pull-up driver 314 can be a metal-oxide-semiconductor-field-effect-transistor (MOSFET). In some embodiments, the pull-up driver 314 can be a p-channel MOSFET (i.e., pFET), where a source terminal of the pFET 314 can be connected to the power source 312 and a drain terminal of the pFET 314 can be connected to a PPM resistor 318 with a resistance R_(ppm).

In some embodiments, the PPM circuit 202 also includes a pull-down driver 336. In some embodiments, the pull-down driver 336 can be a MOSFET. In some embodiments, the pull-down driver 336 can be an n-channel MOSFET (i.e., nFET). A source terminal of the nFET 336 can be grounded, and a drain terminal of the nFET 336 can be connected to the PPM resistor 318.

In some embodiments, the PPM resistor 318 and the drain terminal of the nFET 336 are also electrically connected to the PPM contact pad 204 at a node 322. Some or all the PPM contact pads (e.g., the PPM pins 204) can be electrically connected through the die-to-die connections 205 (see FIG. 2). Thus, the PPM contact pads 204 of the memory chip 25 can be held to an electrical potential V_(ppm) at the node 322.

In some embodiments, the PPM circuit 202 can also include a comparator 328, with a first input terminal 324 at a reference voltage V_(ref) and a second input terminal 326 connected to the node 322. The comparator 328 can be an operational amplifier used for comparing an input voltage V_(in) at the second input terminal 326 with the reference voltage V_(ref) at the first input terminal 324, where an output voltage V_(out) at an output terminal 330 can indicate whether the input voltage V_(in) is above or below the reference voltage V_(ref). For example, the output voltage V_(out) can be a positive voltage when the input voltage V_(in) is larger than the reference voltage V_(ref). On the other hand, the output voltage V_(out) can be a negative voltage when the input voltage V_(in) is smaller than the reference voltage V_(ref).

In some embodiments, the PPM circuit 202 can further include an inverter 332 with an input terminal connected to the output terminal 330 of the comparator 328. The inverter 332 can invert an input signal. For example, when the output voltage V_(out) of the comparator 328 is a positive voltage, a PPM enablement signal enPPM generated by the inverter 332 at an output terminal 334 can be zero, i.e., the PPM enablement signal enPPM=0. On the other hand, when the output voltage V_(out) of the comparator 328 is a negative voltage, the PPM enablement signal enPPM=1. In the other words, when the electrical potential V_(ppm) at the node 322 is larger (or higher) than the reference voltage V_(ref) (i.e., V_(ppm)>V_(ref)), the PPM enablement signal enPPM=0. When the electrical potential V_(pp)m at the node 322 is smaller (or lower) than the reference voltage V_(ref) (i.e., V_(ppm)<V_(ref)), the PPM enablement signal enPPM=1.

In some embodiments, there can be an optional RC filter 344 connected between the node 322 and the second input terminal 326 of the comparator 328. The RC filter 344 can be used to filter out unwanted signals within a certain frequency range.

As discussed previously, the PPM pins on the same memory chip are electrically connected, i.e., all the PPM pins of the same PPM group have the same electrical potential V_(ppm). Therefore, each memory chip only needs one comparator 328 electrically connected at the node 322 to the PPM contact pads 204. And the PPM enablement signal enPPM indicates the electrical potential V_(ppm) for multiple the memory dies on the memory chip.

Referring to FIG. 3, during operation, a first control signal 340 can be sent to a gate terminal 316 of the pFET 314 to switch the pFET 314 on or off. For example, if the first control signal 340 has a voltage less than a threshold voltage of the pFET 314, the pFET 314 can be switched on, and a conductive path can be formed from the power source 312 to the PPM resistor 318. The current flowing through the pull-up driver 314 and the PPM resistor 318 is also referred to as a pull-up current I_(pull_up). If the first control signal 340 has a voltage higher than the threshold voltage of the pFET 314, the pFET 314 can be switched off.

When a second control signal 342 is sent to a gate terminal 338 of the nFET 336, the nFET 336 can be switched on or off. For example, if the second control signal 342 has a voltage higher than a threshold voltage of the nFET 336, the nFET 336 can be switched on, and a conductive path can be formed from the node 322 to the ground. If the second control signal 342 has a voltage less than the threshold voltage of the nFET 336, the nFET 336 can be switched off.

In some embodiments, the pull-down driver 336 can be operated as a current controller. In this example, when the pull-down driver 336 is switched on, the magnitude of the current flowing through the pull-down driver 336 from the node 322 to the ground (also referred to as pull-down current I_(pull_dn)) depends on the second control signal 342. When the pull-down driver 336 is an nFET, as shown in FIG. 3, the pull-down current I_(pull_dn) can be determined by the voltage level of the second control signal 342 and the trans-conductance of the nFET 336. According to some embodiments of the present disclosure, a current profile I_(cc) of a memory die (e.g., the NAND flash memory 100-1) can correspond to the voltage level of the second control signal 342, and thereby correspond to the pull-down current I_(pull_dn). Therefore, the pull-down current I_(pull_dn) can function as a current mirror of the current profile I_(cc) of the memory die.

In some embodiments, the pull-down current I_(pull_dn) can be proportional to a current level of the current profile I_(cc). The pull-down current I_(pull_dn) an can be scaled down proportionally from the current profile I_(cc). For example, if the memory die is operating with 200 mA of current, the pull-down current I_(pull_dn) of the PPM circuit 202 can be 200 μA. Therefore, memory operations and corresponding current can be regulated for each memory die through the pull-down current I_(pull_dn). Furthermore, through the die-to-die connections at the PPM contact pads, peak power operations throughout the entire memory chip can be coordinated between different memory dies.

FIG. 4 shows an exemplary current profile I_(cc) of a memory die (e.g., the NAND flash memory 100 in FIG. 2), according to some embodiments of the present disclosure. The current profile I_(cc) can include two defined current levels, a peak current I_(cp) and a base current I_(cb). The peak current I_(cp) corresponds to a current level when the memory die is performing a peak power operation. The base current I_(cb) corresponds to an average current level when the memory die is performing regular operations. When the current profile I_(cc) of a memory die rises to the base current I_(cb), the memory die arrives at a break point 450. Due to an increasing trend of current, a PPM scheme can be implemented to control total current consumed by the memory chip among the multiple memory dies.

Referring back to FIG. 3, in some embodiments, the pull-down current I_(pull_dn) can also be defined using two current levels, i.e., a high current level I_(H) (or a first current level) and a low current level I_(L) (or a second current level). The high current level I_(H) of the pull-down current I_(pull_dn) corresponds to the peak current I_(cp) of a specific memory die. The low current level I_(L) of the pull-down current I_(pull_dn) corresponds to the base current I_(cb) of the specific memory die.

During operation, according to some embodiments of the present disclosure, only one pull-up driver 314 is switched on (i.e., enabled) in a memory chip and the other pull-up drivers 314 on different memory dies of the same memory chip can be switched off. As such, current only flows from the power source 312 through one PPM resistor 318 on each memory chip. Namely, the PPM circuits 202 on the same memory chip share a shared pull-up driver 314 and a shared PPM resistor 318.

During operation, the pull-down driver 336 can be switched on or off depending on the status of the memory die, and can be independently controlled according to the PPM management scheme discussed below. For example, the NAND flash memory 100-1 (in FIG. 2) can perform a peak power operation using the peak current I_(cp) when the pull-down driver 336 of the PPM circuit 202-1 is switched on, where a conductive path can be formed through the pull-down driver 336 to the ground with the pull-down current I_(pull_dn) at the high current level I_(H). The NAND flash memories 100-1 is prohibited from performing any peak power operation when the pull-down driver 336 of the PPM circuit 202-1 is switched off, where no current can flow through the pull-down driver 336 on the NAND flash memory 100-1.

The electric potential V_(ppm) of the node 322 (or the PPM pins 204) depends on the number of pull-down drivers 336 that are switched on and depends on current levels of the pull-down current I_(pull_dn) going through the pull-down drivers 336. A peak power operation can be performed on a memory die when the pull-down driver 336 is switched on and the pull-down current I_(pull_dn) is at the high current level I_(H). By monitoring the electric potential V_(ppm), a total current I_(total) used by the memory chip can be controlled and the number of peak power operations performed in a memory chip having multiple memory dies can thereby be regulated.

FIG. 5 shows an equivalent PPM circuit 500 on a memory chip of multiple memory dies, according to some embodiments of the present disclosure. The equivalent PPM circuit 500 represents the PPM circuits 202 across different memory dies, as shown in FIGS. 2 and 3. Since only the pull-up driver 314 and the pull-down drivers 336 that are switched on can form conductive paths, FIG. 5 omits those pull-up drivers 314 and pull-down drivers 336 that are switched off. As discussed previously, the node 322 is electrically connected to the PPM pin 204 on the memory die (see FIG. 3), and all the PPM pins 204 in the same memory chip are electrically connected between different memory dies (see FIG. 2). Therefore, the node 322 can be held at the same electrical potential V_(ppm) between different memory dies on the same memory chip, and is illustrated as one intersection point to the PPM resistor 318 in FIG. 5.

In some embodiments, only one pull-up driver 314 can be switched on for peak power management across multiple memory dies on the same memory chip. In some embodiments, the pull-down driver 336 can be switched on in the PPM circuit corresponding to the memory die performing the peak power operation, i.e., using the peak current I_(cp).

In one example, there can be m number of pull-down drivers 336 that are switched on in a memory chip, where m can be any whole number. The pull-down drivers 336 are from the PPM circuits 202 of the memory dies, e.g., NAND flash memory 100-1, 100-2, . . . , 100-m in FIG. 2. The pull-down drivers 336 are connected in parallel with each other. In this configuration, the pull-up current I_(pull_up) flowing through the pull-up driver 314 that is switched on, is the sum of the pull-down current I_(pull_dn), and can be expressed as:

I _(pull_up)=Σ_(i=1) ^(m) I _(pull_dn-i)  (1)

where I_(pull_dn-1), I_(pull_dn-2), . . . , I_(pull_dn-m) are the pull-down current flowing through each of the pull-down drivers 336 that are switched on. The pull-down current I_(pull_dn) can be set at either the high level current I_(H) or the low level current I_(L), depending on the operations performed on the specific memory die.

Since the pull-up driver 314 in FIG. 5 is a shared pull-up driver of the PPM circuits on the memory chip, the pull-up current I_(pull_up) can be a total current of the PPM circuits on the same memory chip. In some embodiments, the pull-up current I_(pull_up) can correspond to a total current I_(total) of the memory chip. The pull-up current I_(pull_up) (in Equation 1) and the total current I_(total) of the memory chip can follow the same scaling ratio as the pull-down current I_(pull_dn) (e.g., the high and low current level I_(H) and I_(L)) of the PPM circuit 202 and the current profile I_(cc) (e.g., the peak and base current I_(cp) and I_(cb)) of the memory chip. For example, if the total current I_(total) of a memory chip is 1000 mA, the pull-up current I_(pull_up) of the PPM circuits 202 can be 1000 μA.

The electric potential V_(ppm) of the node 322 can be expressed as:

V _(ppm) =V _(dd)(R _(ppm) ·I _(pull up))  (2)

wherein R_(ppm) is the resistance of the PPM resistor 318, and V_(dd) is the voltage of the power source 312.

As discussed previously, the reference voltage V_(ref) for the comparator 328 (in FIG. 3) can be selected such that the PPM enablement signal enPPM can be set at enPPM=0 when the electric potential V_(ppm) is higher than the reference voltage V_(ref). In this example, the reference voltage V_(ref) can be defined as:

V _(ref) =V _(dd)−(R _(ppm) ·I _(pull_up_max))  (3)

where I_(pull_up_max) is a maximum pull-up current flowing through the pull-up driver 314 in the PPM circuit 202, corresponding to a maximum total current I_(total_max) allowed on a memory chip. In some embodiments, the maximum pull-up current I_(pull_up_max) of the PPM circuit 202 (in FIG. 2) and the maximum total current I_(total_max) of the memory chip 25 follows the same scaling ratio as the pull-down current I_(pull_dn) (e.g., the high and low current level I_(H) and I_(L)) of the PPM circuit 202 and the current profile Ice (e.g., the peak and base current I_(cp) and I_(cb)) of the memory chip. For example, if the maximum total current I_(total_max) allowed on a memory chip is 1000 mA, the maximum pull-up current I_(pull_up_max) of the PPM circuit 202 can be 1000 μA.

In this example, when the pull-up current I_(pull_up) is less than the maximum pull-up current I_(pull_up_max), based on the Equations (2) and (3), the electric potential V_(pp)m is higher than the reference voltage V_(ref). The PPM enablement signal enPPM can thereby be set at enPPM=0. On the other hand, when the pull-up current I_(pull_up) is more than the maximum pull-up current I_(pull_up_max), the electric potential V_(ppm) is lower than the reference voltage V_(ref). And the PPM enablement signal enPPM can be set at enPPM=1. As such, by regulating the pull-down driver 336 of the PPM circuit 202, the pull-down current I_(pull_dn) on each memory die can be adjusted. The pull-up current I_(pull_up) can be regulated accordingly. By comparing the pull-up current I_(pull_up) that corresponds to the total current I_(total) of the memory chip, with the maximum pull-up current I_(pull_up_max) that is predetermined according to the maximum total current I_(total_max) allowed on the memory chip, the PPM enablement signal enPPM can be set at 0 or 1. In the other words, the reference voltage V_(ref) can be programmed to correspond to the maximum total current I_(total_max) allowed on the memory chip. And the PPM enablement signal enPPM can be used to indicate whether there are still current or power budget to run additional peak power operations. For example, if the PPM enablement signal enPPM=0, the maximum pull-up current I_(pull_up_max) of the PPM circuit 202 has not been reached, indicating that the maximum total current I_(total_max) of the memory chip 25 has not been reached. The memory chip 25 can provide the peak current I_(cp) to at least one of the memory dies, i.e., having enough power (or current) to provide at least one additional memory die to perform peak power operation. On the contrary, when the PPM enablement signal enPPM=1, the maximum pull-up current I_(pull_up_max) of the PPM circuit 202 has been reached, indicating that the maximum total current I_(total_max) of the memory chip 25 has been reached. The memory chip 25 has reached its power (or current) limit and cannot provide additional peak current I_(cp) to any of the memory dies to perform any additional peak power operation.

FIG. 6 illustrates a peak power check routine 600 associated with the peak power management system 200 in FIG. 2 and the PPM circuit 202 in FIG. 3, according to some embodiments of the present disclosure. The PPM scheme described with reference with FIGS. 2-5 is used to determine the reference voltage V_(ref) and generate the PPM enablement signal enPPM to indicate whether the NAND storage system 10 is operating at a current level below the maximum total current I_(total_max) allowed on the memory chip 25. It should be understood that the peak power check (PPC) routine 600 are not exhaustive and that other operation steps can be performed as well before, after, or between any of the illustrated operation steps. In some embodiments, some operation steps of the PPC routine 600 can be omitted or other operation steps can be included, which are not described here for simplicity. In some embodiments, operation steps of the PPC routine 600 can be performed in a different order and/or vary.

The PPC routine 600 provides an exemplary method of managing peak power usage for a memory chip with one or more memory dies, where each memory die includes at least one PPM circuit. The example below is shown for a memory chip, e.g., the memory chip 25 in FIG. 2, where each memory die includes the PPM circuit 202 for checking and regulating peak power operations performed by the memory dies. However, the method can be extended to a memory chip where each memory die includes two or more PPM circuits.

The PPC routine 600 can be implemented before a memory die starts to perform a peak power operation such that the total power (or current) consumed by a memory chip can be regulated and controlled to below a predetermined value, e.g., the maximum total current I_(total_max).

The PPC routine 600 starts at operation step S605, when a NAND storage system (e.g., the NAND storage system 10 in FIG. 1) determines that one of the memory dies (e.g., the NAND flash memory 100-1) on the memory chip 25 arrives at a break point (e.g., the break point 450 shown in FIG. 4). Compared with the current level prior to the break point 450, the increased current consumption on the memory die indicates that the memory die may perform a peak power operation subsequently.

Prior to the break point 450, the PPM circuit 202-1 on the NAND flash memory 100-1 can be at a reset state. At the reset state, the pull-down driver 336-1 is switched off. At the operation step S605, one of the pull-up drivers 314 of the PPM circuits 202 can be switched on as a shared pull-up driver among the multiple memory dies on the memory chip.

At operation step S610, the pull-down driver 336-1 on the NAND flash memory 100-1 can be switched on.

At operation step S615, the pull-down current I_(pull_dn_1) flowing through the pull-down driver 336-1 on the NAND flash memory 100-1 can be set to the high current level I_(H), which corresponds to the peak current I_(cp) needed to perform the peak power operation on the NAND flash memory 100-1.

At operation step S620, the PPM enablement signal enPPM is verified. If the PPM enablement signal enPPM=0, the pull-up current I_(pull_up) flowing through the shared pull-up driver is less than the maximum pull-up current I_(pull_up_max), indicating that the NAND flash memory 100-1 can perform the peak power operation with the peak current I_(cp) without causing a total current I_(total) of the memory chip exceeding the maximum total current I_(total_max).

At operation step S625, the NAND flash memory 100-1 performs the peak power operation running at the peak current I_(cp). In some embodiments, the NAND flash memory 100-1 can also perform any operation running at a current level less than the peak current I_(cp).

If, at operation step S620, the PPM enablement signal enPPM is not zero (e.g., enPPM=1), the PPC routine 600 continues to operation step S630, where the pull-down driver 336-1 on the NAND flash memory 100-1 can be switched off. At operation step S635, the PPC routine 600 is paused and waits for a delay time period t_(dl). In some embodiment, the delay time period t_(dl) is random. In some embodiments, the delay time period t_(dl) can be any suitable time period in a range between 0.1 μs to 100 μs. In some embodiments, the delay time period t_(dl) can be different for each memory die. After the delay time period t_(dl), the PPC routine 600 returns to operation step S620 via loop L1 and the PPM enablement signal enPPM is checked again.

The delay time period t_(dl) is introduced in event that multiple memory dies enter the PPC routine 600 at the same time and multiple pull-down drivers are switched on and set at the high current level I_(H) at the same time. If there is no current/power budget available to run the peak power operations for these memory dies at the same time, the PPM enablement signal enPPM indicates to the multiple memory dies at operation step S620. Then the corresponding pull-down drivers can be switched off on the multiple memory dies simultaneously at operations step S630. By introducing the delay time period t_(dl), the multiple memory dies can return to operation step S620 one at a time, i.e., the requests for peak power operations from multiple memory dies can be de-synchronized. As such, the multiple memory dies can perform the peak power operation sequentially without exceeding the maximum total current I_(total_max) allowed on the memory chip.

At operation step S640, after completing the peak power operation, the pull-down current I_(pull_dn_1) flowing through the pull-down driver 336-1 can be set to the low current level I_(L). As such, the NAND flash memory 100-1 can continue operations with current less than the peak current I_(cp).

In some embodiments, the PPC routine 600 can return back via loop L2 to operation step S605, for example, when another break point is detected after the completion of the present peak power operation.

At operation step S645, the pull-down driver 336-1 of the PPM circuit 202-1 on the NAND flash memory 100-1 can be disabled (i.e., switched off), for example, when the current level of the NAND flash memory 100-1 falls below the base current I_(cb). The PPC routine 600 is finished and can be restarted again if the NAND storage system 10 determines that one of the memory dies on the memory chip enters one of the break points.

When the pull-down current I_(pull_dn) of a specific memory die is set to the high current level I_(H), the current/power budget can be temporary reserved for this specific memory die. Any other memory die on the same memory chip that runs the PPC routine 600 can be queued in the loop of operation steps S620, S630 and S635 unless the total current I_(total) is less than the maximum total current I_(total_max) or until the current/power budget is available on the memory chip, which can be verified at the operation step S620.

Through defining two current levels (e.g., the peak current I_(cp) and the base current I_(cb)) on the current profile I_(cc) of a memory die, and through adjusting the pull-down current I_(pull_dn) of the pull-down driver 336 in the PPM circuit 202 on the memory die accordingly (e.g., switching on/off, setting to the high current level I_(H) and the low current level I_(L)), the electric potential V_(ppm) of the PPM contact pads 204 across multiple memory dies on the memory chip can be regulated because the PPM contact pads 204 on different memory dies can be electrically connected through the die-to-die connections 205 and can be held at the same electric potential V_(ppm). By comparing the electric potential V_(ppm) with the reference voltage V_(ref) predetermined according to the maximum total current Loral max allowed on the memory chip, peak power operations performed by each memory die on the memory chip can be managed using the PPC routine 600. As a result, the total current I_(total) of the memory chip with multiple memory dies can be controlled.

However, the PPM circuit and PPM scheme are not limited to the examples shown in FIGS. 3-6. Variations of the PPM circuit 202 and the PPC routine 600 can provide similar peak power manage for a memory chip with multiple memory dies.

FIG. 7 illustrates another exemplary PPM circuit 202′ on the NAND flash memory 100, according to some embodiments of the present disclosure. The PPM circuit 202′ is similar to the PPM circuit 202. The main difference is that the PPM resistor 318 can be connected between the node 322 and the pull-down driver 336. In this example, during operation, only one pull-down driver 336 is switched on among the multiple memory dies on the same memory chip, while the pull-up driver 314 can be regulated according to the current profile I_(cc) on the memory die. Here, the pull-up current I_(pull_up) of the PPM circuit 202′ can be defined with two current levels, e.g., the high current level I_(H) and the low current level I_(L), corresponding the peak current I_(cp) and the base current I_(cb) of the memory die. In this example, during operation, when there can be m number of pull-up drivers 314 that are switched on in a memory chip, the pull-down current I_(pull_dn) flowing through the pull-down driver 336 that is switched on, is the sum of the pull-up current I_(pull-up), and can be expressed as:

I _(pull_dn)=Σ_(i=1) ^(m) I _(pull_up-i)  (4)

The electric potential V_(pp)m of the node 322 can be expressed as:

V _(ppm) =R _(ppm) ·I _(pull_dn)  (5)

and the reference voltage V_(ref) can be defined as:

V _(ref) =R _(ppm) ·I _(pull_dn_max)  (6)

where I_(pull_dn_max) is a maximum pull-down current flowing through the pull-down driver 336, corresponding to the maximum total current I_(total_max) allowed on a memory chip. Thus, when the pull-down current I_(pull_dn) is larger than the maximum pull-down current I_(pull_dn_max), the electric potential V_(ppm) is higher than the reference voltage V_(ref), and the output voltage V_(out) at the comparator 328 can be positive. In the PPM circuit 202′, the output voltage V_(out) can be directly sent to the PPM enablement signal enPPM without an inverter. According, the PPM enablement signal enPPM=1 when I_(pull_dn)>I_(pull_dn_max). Conversely, enPPM=0 if I_(pull_dn)<I_(pull_dn_max). In this example, PPC routing 600 can be modified by switching the pull-down driver/pull-down current to pull-up driver/pull-up current.

The devices and configurations used for the exemplary PPM circuit 202 in FIG. 3 and the PPM circuit 202′ in FIG. 7 are only for illustration purpose and for simplicity to demonstrate the functionality of the PPM circuit and PPM scheme. In some embodiments, the pull-down driver 336 in FIG. 3 can be replaced by a suitable current source to set the current levels of the pull-down current I_(pull_dn).

Dynamic peak power management of a memory chip discussed above can also be implemented to closely follow the current profile I_(cc) of a memory die. For example, based on the current profile I_(cc) in FIG. 8, the PPM scheme can be separated into multiple phases, where each phase P_(i) can include a peak current I_(i) (i=1, 2, . . . , 6). In this example, when the pull-down driver 336 is switched on, the pull-down current I_(pull_dn) can be adjusted to be proportional to the peak current I_(i) of each phase P_(i). The break point 450 can be inserted at the beginning of phase P₁ and each phase P_(i) if the peak current I_(i) is larger than the peak current I_(i-1) of the previous phase P_(i-1). For example, break points 450 can be inserted at the beginning of phase P₁, P₂ and P₄ in FIG. 8.

Using similar PPC routine 600 in FIG. 6, when a memory die arrives at a break point 450, for example, at the beginning of phase P₂, operation step S605 can be started. The pull-down driver 336 on the memory die can be enabled at operation step S610, and the pull-down current I_(pull_dn) flowing through the pull-down driver 336 can be set at a current level reflecting the peak current I₂ in phase P₂. At operation step S620, the PPM enablement signal enPPM is checked. If the PPM enablement signal enPPM=0, the peak power operation corresponding to the peak current I₂ can be executed by the memory die. Otherwise, the pull-down driver 336 on the memory die can be switched off and the memory die can wait for a delay time period at operation step S635 before checking the PPM enablement signal enPPM again at operation step S620.

If the peak current I_(i) is smaller than the peak current I_(i-1) of the previous phase P_(i-1), no break point is needed at the beginning of the phase P_(i). For example, no break point is inserted in the current profile Inn at the beginning of phase P₃, P₅ and P₆ in the example shown in FIG. 8.

When the peak power operation is completed at operation step S640, the pull-down current I_(pull_dn) can be adjusted to a lower level to be proportional to the next peak current of the memory die. For example, when the peak power operation is completed for phase P₂, the pull-down current I_(pull_dn) of the memory die can be adjusted to be proportional to the peak current I₃ and continues to execute the operations in phase P₃.

At the beginning of phase P₄, another break point 450 is detected. The PPC routine 600 returns back to operation step S605 and the PPM enablement signal enPPM is checked again at operation step S620.

In summary, the present disclosure provides a peak power management (PPM) system for a memory chip with multiple memory dies. The PPM system includes a PPM circuit on each of the multiple memory dies. Each PPM circuit includes a pull-up driver electrically connected to a power source and a PPM resistor; a pull-down driver electrically connected to the PPM resistor; and a PPM contact pad connected to the PPM resistor. PPM contact pads of the multiple memory dies are electrically connected with each other. And the PPM system is configured to manage a peak power operation based on an electric potential of the PPM contact pads.

The present disclosure also provides a method of peak power management (PPM) for a memory chip with multiple memory dies, wherein each of the multiple memory dies includes a PPM circuit having a PPM contact pad. PPM contact pads of the multiple memory dies are electrically connected. The PPM method includes the following steps: switching on a pull-down driver of the PPM circuit on a selected memory die of the memory chip; verifying a PPM enablement signal regulated by a pull-down current flowing through the pull-down driver; and performing a peak power operation on the selected memory die when the PPM enablement signal indicates that a total current of the memory chip is less than a maximum total current allowed for the memory chip.

The foregoing description of the specific embodiments will so fully reveal the general nature of the present disclosure that others can, by applying knowledge within the skill of the art, readily modify and/or adapt, for various applications, such specific embodiments, without undue experimentation, and without departing from the general concept of the present disclosure. Therefore, such adaptations and modifications are intended to be within the meaning and range of equivalents of the disclosed embodiments, based on the disclosure and guidance presented herein. It is to be understood that the phraseology or terminology herein is for the purpose of description and not of limitation, such that the terminology or phraseology of the present specification is to be interpreted by the skilled artisan in light of the disclosure and guidance.

Embodiments of the present disclosure have been described above with the aid of functional building blocks illustrating the implementation of specified functions and relationships thereof. The boundaries of these functional building blocks have been arbitrarily defined herein for the convenience of the description. Alternate boundaries can be defined so long as the specified functions and relationships thereof are appropriately performed.

The Summary and Abstract sections can set forth one or more but not all exemplary embodiments of the present disclosure as contemplated by the inventor(s), and thus, are not intended to limit the present disclosure and the appended claims in any way.

The breadth and scope of the present disclosure should not be limited by any of the above-described exemplary embodiments, but should be defined only in accordance with the following claims and their equivalents. 

What is claimed is:
 1. A peak power management (PPM) system for a memory chip with multiple memory dies, comprising: a PPM circuit on each of the multiple memory dies, each PPM circuit comprising: a pull-up driver electrically connected to a power source and a first end of a PPM resistor; a pull-down driver electrically connected to a second end of the PPM resistor; and a PPM contact pad connected to the second end of the PPM resistor, wherein PPM contact pads of the multiple memory dies are electrically connected with each other; and wherein the PPM system is configured to manage a peak power operation based on an electric potential of the PPM contact pads.
 2. The PPM system of claim 1, wherein the PPM system further comprises a comparator with a first input terminal electrically connected to the PPM contact pads of the multiple memory dies and a second input terminal electrically connected to a reference voltage.
 3. The PPM system of claim 2, wherein an output terminal of the comparator is connected to an inverter.
 4. The PPM system of claim 2, wherein the PPM system further comprises an RC filter electrically connected to the PPM contact pads of the multiple memory dies and the first input terminal of the comparator.
 5. The PPM system of claim 2, wherein the reference voltage is based on a maximum total current allowed on the memory chip.
 6. The PPM system of claim 1, wherein the electric potential of the PPM contact pads is adjusted by a pull-down current flowing through the pull-down driver in the PPM circuit.
 7. The method of claim 6, wherein the pull-down current comprises a high current level, the high current level corresponding to a peak current of the peak power operation.
 8. The PPM system of claim 1, wherein the pull-up driver comprises a p-channel metal oxide semiconductor field effect transistor (MOSFET).
 9. The PPM system of claim 1, wherein the pull-down driver comprises an n-channel metal oxide semiconductor field effect transistor (MOSFET).
 10. The PPM system of claim 1, wherein the PPM contact pads are electrically connected through die-to-die connections, each die-to-die connection comprising a metal interconnect.
 11. The PPM system of claim 1, wherein the PPM contact pads are electrically connected through flip-chip bonding, die-to-die bonding, or wire-bonding.
 12. A method of peak power management (PPM) for a memory chip with multiple memory dies, wherein each of the multiple memory dies comprises a PPM circuit having a PPM contact pad, and wherein PPM contact pads of the multiple memory dies are electrically connected, the method comprising: switching on a pull-down driver of the PPM circuit on a selected memory die of the memory chip; verifying a PPM enablement signal regulated by a pull-down current flowing through the pull-down driver; and performing a peak power operation on the selected memory die when the PPM enablement signal indicates that a total current of the memory chip is less than a maximum total current allowed for the memory chip.
 13. The method of claim 12, further comprising: after switching on the pull-down driver, setting the pull-down current flowing through the pull-down driver on the selected memory die at a high current level, wherein the high current level correspond to a peak current of the peak power operation on the selected memory die.
 14. The method of claim 12, further comprising: after performing the peak power operation, setting the pull-down current flowing through the pull-down driver on the selected memory die to a low current level, wherein the low current level correspond to a base current on the selected memory die.
 15. The method of claim 12, further comprising: switching off the pull-down driver on the selected memory die if the PPM enablement signal indicates that the total current of the memory chip is more than the maximum total current allowed for the memory chip.
 16. The method of claim 15, further comprising: after switching off the pull-down driver, waiting for a delay time period.
 17. The method of claim 12, further comprising: prior to verifying the PPM enablement signal, generating the PPM enablement signal by comparing a reference voltage with an electric potential of the PPM contact pads.
 18. The method of claim 17, further comprising: selecting the reference voltage according to the maximum total current allowed for the memory chip.
 19. The method of claim 17, further comprising: regulating the electric potential of the PPM contact pads through the pull-down current of the pull-down driver, wherein the total current of the memory chip corresponds to a sum of the pull-down current flowing through each pull-down driver on the memory chip.
 20. The method of claim 19, wherein the generating of the PPM enablement signal further comprises: setting the PPM enablement signal to 0 if the electric potential of the PPM contact pads is higher than the reference voltage; and setting the PPM enablement signal to 1 if the electric potential of the PPM contact pads is lower than the reference voltage. 